Internship Jobs Vacancy – Interim Engineering Intern Job Opening at Qualcomm

Responsibilities of Interim Engineering Intern Job Opening at Qualcomm:

• Multimedia Technologies such as Audio and Video codecs, Image Processing,
• Wireless Modem Technologies, such as 4G, WiFi, Bluetooth, and Self-Organizing Networks.
• Platform Level SW, such as Linux, Android, Windows, Board Support Packages.
• IOT Technologies, for Connected Cameras, Smart Assistants, Drones, Virtual Reality, Augmented Reality.

Required skills, qualification and capabilities:

• Development of real-time embedded software and device drivers
• Mobile SW development for Windows Mobile, Android, or Linux
• Good understanding of OS concepts, Data structures, etc
• C/C++ and object-oriented design
• Wireless network standards such as CDMA/GSM/UMTS/LTE
• Linux/UNIX, Linux Drivers, Linux Kernel Development
• Protocols such as TCP/UDP/IP/SIP/RTP, etc
• Multimedia technologies, including Audio, Video, and Imaging
• Excellent analytical and problem-solving skills
• Ability to collaborate and work in teams.
• Good verbal and written communication skills

Opportunities include:

• SW development for Android, Windows Mobile-based Embedded Platforms
• Multimedia software stack, firmware, and driver Development for Wireless
• Modem and connectivity Software nd Firmware Development
• Communication protocol stack Software Development
• Kernel, BSP, and Device Driver Development
• Application SW and UI development.
• SW Architecture for embedded devices based on Android and Windows.
• Design and development based on object-oriented programming.

⚠️ Important Note:

This is a direct hiring opportunity – No hidden fees or charges for applying!

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